1571551-4产品详细规格

规格书	1571551 Drawing
文档	1571551-4 Statement of Compliance RoHS 2 Statement 1571551-4.pdf
Rohs	Lead free / RoHS Compliant
RoHS信息	1571551-4 Statement of Compliance
三维模型	1571551-4.pdf
标准包装	1.200
型	DIP. 0.3 (7.62mm) Row Spacing
位置或引脚数（格）	16 (2 x 8)
球场	0.100 (2.54mm)
安装类型	Through Hole
特点	Closed Frame
触点表面涂层	Tin
触点涂层厚度	-
Standard Package	Rail / Tube
Mating Contact Type	Four-Fingered
Contact Style	Stamped + Formed
Contact Resistance (mΩ)	10
Contact Mount	Thru Hole
Number of Positions	16
Profile	Standard
Lead Free Solder Processes	Wave solder capable to 240°C. Wave solder capable to 260°C. Wave solder c
Product Series	500 Series
Centerline (mm (in))	2.54 [0.100]
Solder Tail Contact Plating	Tin
Leg Style	Straight
Product Type	DIP Socket
RoHSELV Compliance	RoHS compliant. ELV compliant
Frame Style	Closed
Sleeve Material	Nickel
Packaging Method	Tube
Termination (Solder) Post Length (mm in)	3.18 [0.125]
Contact Mating Area Plating Material	Tin
Temperature Range (°C)	105
Insulation Resistance (MΩ)	5.000
Mount Style	Vertical
Height Above PC Board (mm in)	4.57 [0.180]
Row-to-Row Spacing (mm in)	7.62 [0.300]
RoHSELV Compliance History	Always was RoHS compliant
Contact Material	Beryllium Copper
Features	Closed Frame
Mounting Type	Through Hole
Contact Finish	Tin
Number of Positions or Pins (Grid)	16 (2 x 8)
Pitch	0.100 (2.54mm)
Type	DIP. 0.3 (7.62mm) Row Spacing
Other Names	516-AG12D-ES-LF
rohs	Lead free / RoHS Compliant
RoHS	RoHS Compliant
Standard Pack:	30

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