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2-1571551-6产品详细规格
规格书
Rohs Lead free / RoHS Compliant RoHS信息 2-1571551-6 Statement of Compliance 三维模型 2-1571551-6.pdf 标准包装 960 型 DIP. 0.3 (7.62mm) Row Spacing 位置或引脚数（格） 20 (2 x 10) 球场 0.100 (2.54mm) 安装类型 Through Hole 特点 Closed Frame 触点表面涂层 Gold 触点涂层厚度 Flash Mating Contact Type Four-Fingered Contact Style Stamped + Formed Contact Resistance (mΩ) 10 Contact Mount Thru Hole Number of Positions 20 Profile Standard Lead Free Solder Processes Wave solder capable to 240°C. Wave solder capable to 260°C. Wave solder c Product Series 500 Series Centerline (mm (in)) 2.54 [0.100] Solder Tail Contact Plating Tin Leg Style Straight Product Type DIP Socket RoHSELV Compliance RoHS compliant. ELV compliant Frame Style Closed Sleeve Material Nickel Packaging Method Tube Termination (Solder) Post Length (mm in) 3.18 [0.125] Contact Mating Area Plating Material Gold Flash Temperature Range (°C) 125 Insulation Resistance (MΩ) 5.000 Mount Style Vertical Height Above PC Board (mm in) 4.57 [0.180] Row-to-Row Spacing (mm in) 7.62 [0.300] RoHSELV Compliance History Always was RoHS compliant Contact Material Beryllium Copper Product DIP / SIP Sockets RoHS RoHS Compliant Standard Pack: 24
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