1734449-1产品详细规格

规格书
Rohs	Lead free / RoHS Compliant
RoHS信息	1734449-1 Statement of Compliance
三维模型	1734449-1.pdf
标准包装	2.000
Card 型	CompactFlash® - Type I. II
位置数	50
Connector 型	Connector
Insertion. Removal Method	Push In. Pull Out
Ejector Side	-
安装类型	Surface Mount. Right Angle
特点	Board Guide. Card Guide
以上董事会高度	0.248 (6.30mm)
安装功能	Reverse - Bottom
包装材料	Tray
触点表面涂层	Gold
触点涂层厚度	15µin (0.38µm)
Holddowns	With
Vacuum Tape	Without
Housing Material	Thermoplastic
Number of Positions	50
Lead Type	Surface Mount - Inline leads
RoHSELV Compliance	RoHS compliant. ELV compliant
Lead Free Solder Processes	Reflow solder capable to 245°C. Reflow solder capable to 260°C
Format	CompactFlash™
Solder Tail Contact Plating	Matte Tin
Centerline (mm in)	1.27 [0.050]
Mount Angle	Right Angle
Number of Rows	Dual
Header Type	Type I. Type II
Shielded	No
Region	Americas
Packaging Method	Tray
Contact Mating Area Plating Material	Gold (15)
Housing Flammability Rating	UL 94V-0
Color	White
Contact Underplating	Nickel
CompactFlash™ Product Type	Header Only
Mounting Style	Bottom (Printed Circuit Board)
RoHSELV Compliance History	Always was RoHS compliant
Contact Material	Copper Alloy
Selling Alternatives	1470102-1
Subcategory	Connector Memory Card
Packaging	Tray
Lead Time	365 Days
Standard Pack:	20
associated	1734449-1

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