| 规格书 |  |
| 类型 | Wire to Board |
| 间距 | 2.54 mm |
| 行数 | 2 |
| 触点数 | 50 |
| 性别 | HDR |
| 触点电镀 | Pre-Tin |
| 端接方式 | Solder |
| 标准包装 | Trays |
| PCB极化 | With |
| PCB安装角度 | Vertical |
| 外壳材料 | PBT - GF |
| 位置数 | 50 |
| 简介 | Standard |
| Lead Free Solder Processes | Wave solder capable to 240°C. Wave solder capable to 260°C. Wave solder c |
| PCB极化方式 | Polarizing Post |
| 产品类型 | Header |
| 房屋进入方式 | Top |
| RoHSELV合规性 | RoHS compliant. ELV compliant |
| 要终止 | Printed Circuit Board |
| 终止(焊接)长度(毫米) | 2.90 [0.114] |
| 接触弹簧镀层 | Tin |
| 壳体防火等级 | UL 94V-0 |
| 评论 | This spring header mates with either crimp/IDC or AMP-LATCH receptacle connecto |
| RoHSELV符合记录 | Always was RoHS compliant |
| 颜色 | Black |
| 触点弹簧材质 | Phosphor Bronze |
| 厚度(毫米( ) ) | 0.15 [0.006] |
| PCB保持力特性 | No |
| 触点类型 | Spring |
| 中心线矩阵(毫米( ) ) | 2.54 x 2.54 [.100 x .100] |
| 专有名称 | AMP-ULTREX |
| 配合锁扣 | Without |
| 产品特点 | Board Guide |
| 安装类型 | Through Hole |
| 连接器类型 | Header. Shrouded |
| 触点表面涂层 | Tin |
| 封装 | Bulk |
| 端子 | Solder |
| Contact Finish Thickness | 15µin (0.38µm) |
| 行间距 | 0.100' (2.54mm) |
| 加载位置的数目 | All |
| RoHS指令 | Lead free / RoHS Compliant |