TSW-113-26-S-S产品详细规格

规格书	TSW Series Drawing xTSW (S.D.T) TH & RA Footprint HTSW. TSW Series Spec Sheet
类型	Unshrouded Header
行数	1
触点数	13
性别	HDR
触点电镀	Gold Over Nickel
端接方式	Solder
标准包装	Bulk
触点接合长度	0.230' (5.84mm)
安装类型	Through Hole
颜色	Black
连接器类型	Header. Unshrouded
触点表面涂层	Gold
封装	Bulk
位置数	13
间距	0.100' (2.54mm)
触点类型	Male Pin
端子	Solder
Contact Finish Thickness	30µin (0.76µm)
其他名称	SAM1081-13
加载位置的数目	All
RoHS指令	Lead free / RoHS Compliant
mating	CES-113-01-T-S SSQ-113-03-G-S SSM-113-S-SH SSQ-113-02-G-S SLW-113-01-T-S SSW-113-01-S-S More>SSW-113-02-T-S SSQ-113-02-S-S SSM-113-L-SV SSW-113-02-S-S SSM-113-S-SV BCS-113-L-S-TE BCS-113-L-S-PE SSW-113-01-T-S BCS-113-L-S-HE SSQ-113-01-T-S SSW-113-01-G-S SSQ-113-01-G-S SSQ-113-02-S-S-RA SSW-113-02-G-S SSQ-113-02-T-S SLW-113-01-G-S SLW-113-01-S-S SSQ-113-03-T-S-RA SSW-113-02-G-S-RA SSQ-113-03-S-S SSQ-113-01-S-S SSQ-113-03-S-S-RA SSQ-113-03-T-S CES-113-01-S-S SSM-113-L-SH SSW-113-02-S-S-RA SSQ-113-03-G-S-RA SSQ-113-02-T-S-RA SSQ-113-02-G-S-RA

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