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1-390263-4
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1-390263-4

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1-390263-4产品详细规格

规格书 1-390263-4
1-390263-4
390263
文档 1-390263-4 Statement of Compliance
RoHS 2 Statement
1-390263-4.pdf
Rohs Lead free / RoHS Compliant
RoHS信息 1-390263-4 Statement of Compliance
三维模型 1-390263-4.pdf
标准包装 9.600
DIP. 0.6 (15.24mm) Row Spacing
位置或引脚数(格) 40 (2 x 20)
球场 0.100 (2.54mm)
安装类型 Through Hole
特点 Open Frame
触点表面涂层 Tin
触点涂层厚度 60µin (1.52µm)
Type DIP Socket
Gender SKT
Number of Contacts 40
Pitch 2.54 mm
Termination Method Solder
Mounting Through Hole
Body Orientation Straight
Number of Rows 2
Standard Package Bulk
Mating Contact Type Dual Leaf
Contact Style Stamped + Formed
Housing Material Thermoplastic
Contact Resistance (mΩ) 30
Contact Mount Thru Hole
Number of Positions 40
Profile Over-The-Component
Lead Free Solder Processes Wave solder capable to 240°C. Wave solder capable to 260°C. Wave solder c
Row-to-Row Spacing (mm in) 15.24 [0.600]
Centerline (mm in) 2.54 [0.100]
Leg Style Straight
Product Type DIP Socket
RoHSELV Compliance RoHS compliant. ELV compliant
Frame Style Open
Packaging Method Tube
Contact Mating Area Plating Material Tin
Temperature Range (°C) -40 – +105
Insulation Resistance (MΩ) 10.000
Mount Style Vertical
Color Black
Height Above PC Board (mm (in)) 5.10 [0.200]
Contact Material Phosphor Bronze
RoHSELV Compliance History Always was RoHS compliant
Termination (Solder) Post Length (mm (in)) 3.00 [0.118]
Features Open Frame
Mounting Type Through Hole
Contact Finish Tin
Number of Positions or Pins (Grid) 40 (2 x 20)
Contact Finish Thickness 60µin (1.52µm)
rohs Lead free / RoHS Compliant
Product DIP / SIP Sockets
Product Category IC & Component Sockets
RoHS RoHS Compliant
Standard Pack: 12

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