1-390263-4产品详细规格

规格书	390263
文档	1-390263-4 Statement of Compliance RoHS 2 Statement 1-390263-4.pdf
Rohs	Lead free / RoHS Compliant
RoHS信息	1-390263-4 Statement of Compliance
三维模型	1-390263-4.pdf
标准包装	9.600
型	DIP. 0.6 (15.24mm) Row Spacing
位置或引脚数（格）	40 (2 x 20)
球场	0.100 (2.54mm)
安装类型	Through Hole
特点	Open Frame
触点表面涂层	Tin
触点涂层厚度	60µin (1.52µm)
Type	DIP Socket
Gender	SKT
Number of Contacts	40
Pitch	2.54 mm
Termination Method	Solder
Mounting	Through Hole
Body Orientation	Straight
Number of Rows	2
Standard Package	Bulk
Mating Contact Type	Dual Leaf
Contact Style	Stamped + Formed
Housing Material	Thermoplastic
Contact Resistance (mΩ)	30
Contact Mount	Thru Hole
Number of Positions	40
Profile	Over-The-Component
Lead Free Solder Processes	Wave solder capable to 240°C. Wave solder capable to 260°C. Wave solder c
Row-to-Row Spacing (mm in)	15.24 [0.600]
Centerline (mm in)	2.54 [0.100]
Leg Style	Straight
Product Type	DIP Socket
RoHSELV Compliance	RoHS compliant. ELV compliant
Frame Style	Open
Packaging Method	Tube
Contact Mating Area Plating Material	Tin
Temperature Range (°C)	-40 – +105
Insulation Resistance (MΩ)	10.000
Mount Style	Vertical
Color	Black
Height Above PC Board (mm (in))	5.10 [0.200]
Contact Material	Phosphor Bronze
RoHSELV Compliance History	Always was RoHS compliant
Termination (Solder) Post Length (mm (in))	3.00 [0.118]
Features	Open Frame
Mounting Type	Through Hole
Contact Finish	Tin
Number of Positions or Pins (Grid)	40 (2 x 20)
Contact Finish Thickness	60µin (1.52µm)
rohs	Lead free / RoHS Compliant
Product	DIP / SIP Sockets
Product Category	IC & Component Sockets
RoHS	RoHS Compliant
Standard Pack:	12

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