3-1571550-0产品详细规格

规格书	1571550
文档	3-1571550-0 Statement of Compliance RoHS 2 Statement 3-1571550-0.pdf
Rohs	Lead free / RoHS Compliant
RoHS信息	3-1571550-0 Statement of Compliance
三维模型	3-1571550-0.pdf
标准包装	1.500
型	DIP. 0.6 (15.24mm) Row Spacing
位置或引脚数（格）	32 (2 x 16)
球场	0.100 (2.54mm)
安装类型	Through Hole
特点	Closed Frame
触点表面涂层	Gold
触点涂层厚度	25µin (0.63µm)
Mating Contact Type	Four-Fingered
Contact Style	Screw Machine
Housing Material	Thermoplastic Polyester
Contact Resistance (mΩ)	10
Contact Mount	Thru Hole
Number of Positions	32
Profile	Standard
Lead Free Solder Processes	Wave solder capable to 240°C. Wave solder capable to 260°C. Wave solder c
Product Series	500 Series
Centerline (mm (in))	2.54 [0.100]
Solder Tail Contact Plating	Tin
Insulation Resistance (MΩ)	5.000
Product Type	DIP Socket
RoHSELV Compliance	RoHS compliant. ELV compliant
Frame Style	Closed
Sleeve Material	Brass/Copper
Packaging Method	Tube
Termination (Solder) Post Length (mm in)	3.18 [0.125]
Contact Mating Area Plating Material	Gold (25)
Temperature Range (°C)	-55 – +105
Housing Flammability Rating	UL 94V-0
Leg Style	Straight
Mount Style	Vertical
Height Above PC Board (mm in)	3.43 [0.135]
Row-to-Row Spacing (mm in)	15.24 [0.600]
RoHSELV Compliance History	Always was RoHS compliant
Contact Material	Beryllium Copper
Features	Closed Frame
Mounting Type	Through Hole
Standard Package	1.500
Contact Finish	Gold
Number of Positions or Pins (Grid)	32 (2 x 16)
Pitch	0.100 (2.54mm)
Contact Finish Thickness	25µin (0.63µm)
Type	DIP. 0.6 (15.24mm) Row Spacing
Other Names	532-AG11D-LF
rohs	Lead free / RoHS Compliant

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