2-1571550-1产品详细规格

规格书	1571550
文档	2-1571550-1 Statement of Compliance RoHS 2 Statement 2-1571550-1.pdf
Rohs	Lead free / RoHS Compliant
RoHS信息	2-1571550-1 Statement of Compliance
三维模型	2-1571550-1.pdf
标准包装	3.200
型	DIP. 0.3 (7.62mm) Row Spacing
位置或引脚数（格）	6 (2 x 3)
球场	0.100 (2.54mm)
安装类型	Through Hole
特点	Closed Frame
触点表面涂层	Gold
触点涂层厚度	25µin (0.63µm)
Mating Contact Type	Four-Fingered
Contact Style	Screw Machine
Housing Material	Thermoplastic Polyester
Contact Resistance (mΩ)	10
Contact Mount	Thru Hole
Number of Positions	6
Profile	Standard
Lead Free Solder Processes	Wave solder capable to 240°C. Wave solder capable to 260°C. Wave solder c
Product Series	500 Series
Centerline (mm (in))	2.54 [0.100]
Solder Tail Contact Plating	Tin
Insulation Resistance (MΩ)	5.000
Product Type	DIP Socket
RoHSELV Compliance	RoHS compliant. ELV compliant
Frame Style	Closed
Sleeve Material	Brass/Copper
Packaging Method	Tube
Termination (Solder) Post Length (mm in)	3.18 [0.125]
Contact Mating Area Plating Material	Gold (25)
Temperature Range (°C)	-55 – +105
Housing Flammability Rating	UL 94V-0
Leg Style	Straight
Mount Style	Vertical
Height Above PC Board (mm in)	3.43 [0.135]
Row-to-Row Spacing (mm in)	7.62 [0.300]
RoHSELV Compliance History	Always was RoHS compliant
Contact Material	Beryllium Copper
Features	Closed Frame
Mounting Type	Through Hole
Standard Package	3.200
Contact Finish	Gold
Number of Positions or Pins (Grid)	6 (2 x 3)
Pitch	0.100 (2.54mm)
Contact Finish Thickness	25µin (0.63µm)
Type	DIP. 0.3 (7.62mm) Row Spacing
rohs	Lead free / RoHS Compliant
Standard Pack:	80

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