4-1571551-1产品详细规格

规格书	1571551 Drawing
文档	4-1571551-1 Statement of Compliance RoHS 2 Statement 4-1571551-1.pdf
Rohs	Lead free / RoHS Compliant
RoHS信息	4-1571551-1 Statement of Compliance
三维模型	4-1571551-1.pdf
标准包装	12.800
型	DIP. 0.3 (7.62mm) Row Spacing
位置或引脚数（格）	6 (2 x 3)
球场	0.100 (2.54mm)
安装类型	Through Hole
特点	Closed Frame
触点表面涂层	Gold
触点涂层厚度	25µin (0.63µm)
Mating Contact Type	Four-Fingered
Contact Style	Stamped + Formed
Contact Resistance (mΩ)	10
Contact Mount	Thru Hole
Number of Positions	6
Profile	Standard
Lead Free Solder Processes	Wave solder capable to 240°C. Wave solder capable to 260°C. Wave solder c
Row-to-Row Spacing (mm (in))	7.62 [0.300]
Solder Tail Contact Plating	Tin
Centerline (mm in)	2.54 [0.100]
Leg Style	Straight
Product Type	DIP Socket
RoHSELV Compliance	RoHS compliant. ELV compliant
Frame Style	Closed
Sleeve Material	Nickel
Packaging Method	Tube
Contact Mating Area Plating Material	Gold (25)
Temperature Range (°C)	125
Insulation Resistance (MΩ)	5.000
Mount Style	Vertical
Height Above PC Board (mm (in))	3.43 [0.135]
Contact Material	Beryllium Copper
RoHSELV Compliance History	Always was RoHS compliant
Termination (Solder) Post Length (mm (in))	3.18 [0.125]
Features	Closed Frame
Mounting Type	Through Hole
Standard Package	12.800
Contact Finish	Gold
Number of Positions or Pins (Grid)	6 (2 x 3)
Pitch	0.100 (2.54mm)
Contact Finish Thickness	25µin (0.63µm)
Type	DIP. 0.3 (7.62mm) Row Spacing
Other Names	506-AG11D-ES-LF
rohs	Lead free / RoHS Compliant
Factory Pack Quantity	80
Product	DIP / SIP Sockets
Product Category	IC & Component Sockets
RoHS	RoHS Compliant

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